Specific Gravity 3.0 G/Cc Silicone Thermal Pads Conductive For Notebook
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Specific gravity 3.0 g/cc Good thermal conductive silicone pads for notebook
The TIF130-30-06UF is not only designed to take advantage of the gap heat transfer, to fill gaps, complete the heat transfer between heating and cooling parts, but also played insulation, damping, sealing and so on, to meet the equipment miniaturization and ultra-thin design Requirements, which is a highly technology and use, and the thickness of the wide range of applications, is also an excellent thermal conductivity filler material.
TIF100-30-06UF-Series-Datasheet-.pdf
Features > Good thermal conductive: 3.0 W/mK >Thickness: 0.75mmT >hardness:75±5 shore 00 >Colour: White >Moldability for complex parts
Applications >mainboard/mother board >notebook >power supply >Heat pipe thermal solutions >Memory Modules >Mass storage devices
Company Profile With a wide range, good quality, reasonable prices and stylish designs, Ziitek thermal conductive interface materials are extensively used in Mainboards, VGA cards, Notebooks, DDR&DDR2 products, CD-ROM ,LCD TV, PDP products, Server Power products, Down lamps, Spotlights, Street lamps, Daylight lamps, LED Server Power products and others.
Standard Sheets Sizes: 8" x 16"(203mm x 406mm)
TIF™ series Individual die cut shapes can be supplied.
FAQ: Q: How do I place an order? A:1. Click the "Sent messages" button to continue with the process. 2. Fill out the message form by entering a subject line, and message to us. This message should include any questions you might have about the products as well as your purchase requests. 3. Click the "Send" button when you are finished to complete the process and send your message to us 4. We will reply you as soon as possible with Email or online |
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| Product Tags: 3.0 g/cc thermally conductive gap filler pads 3.0 g/cc silicone thermal pads silicone thermal pads for notebook | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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