3.5mmt Notebook Heat Insulation Silicone Pad Outgassing 0.35%
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3.5mm Moldability for Complex Parts Silicone Pads for Notebook, Outgasing 0.35%
The TIF1140-30-02US use a special process, with silicone as the base material, adding thermal conductive powder and flame retardant together to make the mixture to become thermal interface material. This is effective in lower the thermal resistance between the heat source and the heat sink.
TIF100-30-02US-Datasheet-REV02.pdf
Features > Good thermal conductive: 3.0 W/mK >Thickness:3.5mmT >hardness:20 shore 00 >Colour: Gray >Good thermal conductive >Electrically isolating >High durability
Applications >mainboard/mother board >notebook >power supply >Heat pipe thermal solutions >Memory Modules >Mass storage devices
Company Profile Ziitek Electronic Material and Technology Ltd. is dedicated to developing composite thermal solution and manufacturing superior thermal interface materials for competitive market. Our vast experience allows us to assist our customers best in thermal engineering field. We serve customers with customized products, full product lines and flexible production, which makes us be the best and reliable partner of you. Let's make your design more perfect!
Standard Sheets Sizes: 8" x 16"(203mm x 406mm)
TIF™ series Individual die cut shapes can be supplied.
FAQ: Q:How can we get detailed price list? A:Please offer us detailed information of the product such as Size(length,width,thickness),color,specific packaging requirements and purchasing quantity. Q: What kind of packaging you offer? A: During the packaging process, preventive measures will be taken by us to assure that the goods are in a good condition during storage and delivery. |
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| Product Tags: 3.5mmt thermally conductive gap filler pads 3.5mmt heat insulation silicone pad notebook heat insulation silicone pad | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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