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Dongguan Ziitek Electronic Materials & Technology Ltd.
Dongguan Ziitek Electronic Materials & Technology Ltd. Professional TIM Manufacturer
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2.5mmt Thermal Gap Pad Easy Release Construction For Smd Led Module

2.5mmt Thermal Gap Pad Easy Release Construction For Smd Led Module

Brand Name ZIITEK
Model Number TIF1100-30-02US
Certification UL and RoHs
Place of Origin China
Minimum Order Quantity 1000pcs
Price negotiation
Supply Ability 100000pcs/day
Delivery Time 3-5 work days
Packaging Details 1000pcs/bag
name 2.5mmT Easy Release Construction Thermal Gap Pad For SMD LED module,-40 to 160℃
Thickness 2.5mmT
Continuos Use Temp -40 to 160℃
keyword Thermal Gap Pad
Fire rating 94 V0
Hardness 20 Shore 00
Detailed Product Description

 

2.5mmT Easy Release Construction Thermal Gap Pad For SMD LED module,-40 to 160℃

 

     The TIF1100-30-02US is a silicone based, thermally conductive gap pad. Its unreinforced construction allows additional compliancy. This product has low hardness is conformable and is electrically isolating. The low modulus characteristic of the product offers optimal thermal performance with the ease of handling.

 

 

TIF100-30-02US-Datasheet-REV02.pdf

 

Features

> Good thermal conductive: 3.0 W/mK 

>Thickness:2.5mmT

>hardness:20 shore 00

>Colour: Gray

>Moldability for complex parts

>Outstanding thermal performance

>High tack surface reduces contact resistance

 

 

Applications

>Waterproof LED Power

>SMD LED module

>LED Flesible strip, LED bar

>LED PanelLight

>LED floor light

>Routers

 

Typical Properties of TIF1100-30-02US Series
Color
Gray
Visual
Composite Thickness
Thermal Impedance@10psi
(℃-in²/W)
Construction &
Compostion
Ceramic filled silicone elastomer
***
10mils / 0.254 mm
0.16
20mils / 0.508 mm
0.20

Specific gravity

2.9 g/cc
ASTM D297
30mils / 0.762 mm
0.31
40mils / 1.016 mm
0.36
Thickness
2.5mmT
***
50mils / 1.270 mm
0.42
60mils / 1.524 mm
0.48
Hardness
20 Shore 00
ASTM 2240
70mils / 1.778 mm
0.53
80mils / 2.032 mm
0.63
Outgasing (TML)
0.35%
ASTM E595
90mils / 2.286 mm
0.73
100mils / 2.540 mm
0.81
Continuos Use Temp
-40 to 160℃
***
110mils / 2.794 mm
0.86
120mils / 3.048 mm
0.93
Dielectric Breakdown Voltage
>5500 VAC
ASTM D149
130mils / 3.302mm
1.00
140mils /3.556 mm
1.08
Dielectric Constant
3.8 MHz
ASTM D150
150mils / 3.810 mm
1.13
160mils / 4.064 mm
1.20
Volume Resistivity
1.0X1012
Ohm-cm
ASTM D257
170mils / 4.318 mm
1.24
180mils / 4.572 mm
1.32
Fire rating
94 V0
equivalent
UL
190mils / 4.826 mm
1.41
200mils / 5.080 mm
1.52
Thermal conductivity
3.0 W/m-K
ASTM D5470
Visua l/ ASTM D751
ASTM D5470
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 

 

 

 

 

 

 

 

 

 

Company Profile

With a wide range, good quality, reasonable prices and stylish designs, Ziitek thermal conductive interface materials are extensively used in Mainboards, VGA cards, Notebooks, DDR&DDR2 products, CD-ROM ,LCD TV, PDP products, Server Power products, Down lamps, Spotlights, Street lamps, Daylight lamps, LED Server Power products and others.

 

 

Packaging Details & Lead time

 

The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

 

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

 

 

FAQ:

Q:How can we get detailed price list?

A:Please offer us detailed information of the product such as Size(length,width,thickness),color,specific packaging requirements and purchasing quantity.

Q: What kind of packaging you offer?

A: During the packaging process, preventive measures will be taken by us to assure that the goods are in a good condition during storage and delivery.

Product Tags: 2.5mmt thermal gap pad   smd led module thermal gap pad   2.5mmt gap pad  
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