2.5mmt Thermal Gap Pad Easy Release Construction For Smd Led Module
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2.5mmT Easy Release Construction Thermal Gap Pad For SMD LED module,-40 to 160℃
The TIF1100-30-02US is a silicone based, thermally conductive gap pad. Its unreinforced construction allows additional compliancy. This product has low hardness is conformable and is electrically isolating. The low modulus characteristic of the product offers optimal thermal performance with the ease of handling.
TIF100-30-02US-Datasheet-REV02.pdf
Features > Good thermal conductive: 3.0 W/mK >Thickness:2.5mmT >hardness:20 shore 00 >Colour: Gray >Moldability for complex parts >Outstanding thermal performance >High tack surface reduces contact resistance
Applications >Waterproof LED Power >SMD LED module >LED Flesible strip, LED bar >LED PanelLight >LED floor light >Routers
Company Profile With a wide range, good quality, reasonable prices and stylish designs, Ziitek thermal conductive interface materials are extensively used in Mainboards, VGA cards, Notebooks, DDR&DDR2 products, CD-ROM ,LCD TV, PDP products, Server Power products, Down lamps, Spotlights, Street lamps, Daylight lamps, LED Server Power products and others.
Packaging Details & Lead time
The packaging of thermal pad 1.with PET film or foam-for protection 2. use Paper Card To Separate Each Layer 3. export carton inside and outside 4. meet with customers' requirement-customized
Lead Time :Quantity(Pieces):5000 Est. Time(days): To be negotiated
FAQ: Q:How can we get detailed price list? A:Please offer us detailed information of the product such as Size(length,width,thickness),color,specific packaging requirements and purchasing quantity. Q: What kind of packaging you offer? A: During the packaging process, preventive measures will be taken by us to assure that the goods are in a good condition during storage and delivery. |
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| Product Tags: 2.5mmt thermal gap pad smd led module thermal gap pad 2.5mmt gap pad | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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