3.0mmt Silicone Gap Filler Pad For Moldability Complex Parts
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3.0mmT Outstanding Thermal Performance Silicone Pads for Moldability for Complex Parts
The TIF1120-32-05US thermal silicone pad is a product with both performance and economy. It is a unique thermal pad with low oil permeability, low thermal resistance, high softness and high compliance.It can work stably at -40℃~160℃ and meet the requirement of UL94V0.
TIF100-32-05US-Series-Datasheet-REV02.pdf
Features > Good thermal conductive: 3.2 W/mK >Thickness:3.0mmT >hardness:20 shore 00 >Colour: blue >Moldability for complex parts >Outstanding thermal performance >High tack surface reduces contact resistance
Applications >Automotive engine control units >Telecommunication hardware >Handheld portable electronics >Semiconductor automated test equipment (ATE) >CPU >display card
Company Profile Ziitek Electronic Material and Technology Ltd. provides product solutions to equipment product which generates too much heat affecting its high performance when using. Plus thermal products can control and manage heat to keep it cool to some extent.
Standard Sheets Sizes: 8" x 16"(203mm x 406mm)
TIF™ series Individual die cut shapes can be supplied.
FAQ: Q: How do I place an order? A:1. Click the "Sent messages" button to continue with the process. 2. Fill out the message form by entering a subject line, and message to us. This message should include any questions you might have about the products as well as your purchase requests. 3. Click the "Send" button when you are finished to complete the process and send your message to us 4. We will reply you as soon as possible with Email or online |
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| Product Tags: 3.0mmt silicone gap filler 3.2 w/mk silicone gap filler | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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