Silicone 2.0mmT Thermal Gap Pad For Heat Pipe Thermal Solutions
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Moldability for complex parts -40 to 160℃ silicone pads for Heat pipe thermal solutions
The TIF180-30-05US use a special process, with silicone as the base material, adding thermal conductive powder and flame retardant together to make the mixture to become thermal interface material. This is effective in lower the thermal resistance between the heat source and the heat sink.
TIF100-30-05US-Series-Datasheet.pdf
Features > Good thermal conductive: 3.0 W/mK >Thickness:2.0mmT >hardness:18 shore 00 >Colour: blue >Electrically isolating >High durability >Good thermal conductive
Applications >LED Power Supply >LED Controller >LED Ceilinglamp >Monitoring the Power Box >AD-DC Power Adapters >Rainproof LED Power
Company Profile With a wide range, good quality, reasonable prices and stylish designs, Ziitek thermal conductive interface materials are extensively used in Mainboards, VGA cards, Notebooks, DDR&DDR2 products, CD-ROM ,LCD TV, PDP products, Server Power products, Down lamps, Spotlights, Street lamps, Daylight lamps, LED Server Power products and others.
Packaging Details & Lead time
The packaging of thermal pad 1.with PET film or foam-for protection 2. use Paper Card To Separate Each Layer 3. export carton inside and outside 4. meet with customers' requirement-customized
Lead Time :Quantity(Pieces):5000 Est. Time(days): To be negotiated
FAQ: Q: Are you trading company or manufacturer ? A: We are manufacturer in China Q: How long is your delivery time? A: Generally it is 3-7 work days if the goods are in stock. or it is 7-10 work days if the goods are not in stock, it is according to quantity. |
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| Product Tags: 2mmt thermal gap pad heat pipe solutions thermal gap pad 3.0 w mk gap pad material | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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