Soft Compressible 1.5mmt Thermally Conductive Gap Filler For Low Stress Applications
|
|
Soft and compressible for low stress applications 1.5mmT silicone sheets for Mass storage devices
The TIF160-40-11US is a silicone based, thermally conductive gap pad. Its unreinforced construction allows additional compliancy. This product has low hardness is conformable and is electrically isolating. The low modulus characteristic of the product offers optimal thermal performance with the ease of handling
TIF100-40-11US-Series-Datasheet.pdf
Features > Good thermal conductive: 4.0 W/mK >Thickness:1.5mmT >hardness:20 shore 00 >Colour: Gray >RoHS compliant >UL recognized >Easy release construction
Applications >Automotive electronics >Set top boxes >Audio and video components >IT infrastructure >GPS navigation and other portable devices >CD-Rom, DVD-Rom cooling
Company Profile
Ziitek company is a high-tech enterprise which dedicated to the R&D, manufacture and sales of the thermal interface materials (TIMs). We have rich experiences in this field which can support you the latest, most effective and one -step thermal management solutions. We have many advanced production equipments,full test equipments and fully automatic coating production lines which can support the production for high performance thermal silicone pad, thermal graphite sheet/ film, thermal double-sided tape, thermal insulation pad, thermal ceramic pad, phase change material, thermal grease etc. UL94 V-0, SGS and ROHS are compliant.
Standard Sheets Sizes: 8" x 16"(203mm x 406mm)
TIF™ series Individual die cut shapes can be supplied.
FAQ: Q: What is your terms of payment ? A: Payment<=2000USD, T/T in advance. Paying in time and faithful for several months, we can apply other payment term for you, pay together in every month or 30 days. |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Product Tags: soft thermally conductive gap filler 1.5mmt thermally conductive gap filler 4.0 w mk gap pad thermal conductivity | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Sticky Soft Heatsink Cooling Gap Filler Thermal Conductive Silicone Pad |
|
Thermal Conductivity 8.0W/m-K Heat Sink Thermal Pad for Electronic Devices CPU PC GPU |
|
Cooling Thermal Conductive Silicone Gap Pad Filler For Laptop |
|
2.5mmT Thickness 8W/mk Thermal Silicone Pad for AI Thermal Interface Material |
|
Thermal Interface Material Pads Thermal Silicone Pad For New Energy Vehicle Batteries PCB |
|
Material Specific Thermal Conductivity Thermal Pad For Audio Video Devices |