1.0mmt Silicone Thermal Gap Pad For Heat Pipe Thermal Solutions
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Moldability for complex parts 1.0mmT silicone pads for Heat pipe thermal solutions
The TIF140-40-11US is not only designed to take advantage of the gap heat transfer, to fill gaps, complete the heat transfer between heating and cooling parts, but also played insulation, damping, sealing and so on, to meet the equipment miniaturization and ultra-thin design Requirements, which is a highly technology and use, and the thickness of the wide range of applications, is also an excellent thermal conductivity filler material.
TIF100-40-11US-Series-Datasheet.pdf
Features > Good thermal conductive: 4.0 W/mK >Thickness:1.0mmT >hardness:20 shore 00 >Colour: Gray >Moldability for complex parts >Outstanding thermal performance >High tack surface reduces contact resistance
Applications >mainboard/mother board >notebook >power supply >Heat pipe thermal solutions >Memory Modules >Mass storage devices
Company Profile
With a wide range, good quality, reasonable prices and stylish designs, Ziitek thermal conductive interface materials are extensively used in Mainboards, VGA cards, Notebooks, DDR&DDR2 products, CD-ROM ,LCD TV, PDP products, Server Power products, Down lamps, Spotlights, Street lamps, Daylight lamps, LED Server Power products and others.
Standard Sheets Sizes: 8" x 16"(203mm x 406mm)
TIF™ series Individual die cut shapes can be supplied.
FAQ: Q: Do you provide samples ? is it free or extra cost? A: Yes, we could offer samples free of charge Q: Do you offer free samples ? A: Yes, we are willing to offer free sample. |
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| Product Tags: 1.0mmt thermal gap pad heat pipe thermal gap pad thermal gap filler material 4.0 w mk | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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