4.0mmt Smd Led Module Thermal Gap Pad 20 Shore 00
|
high cost-effective 4.0mmT thermal gap filler for SMD LED module, 20 Shore 00
The TIF1160-50-11US is not only designed to take advantage of the gap heat transfer, to fill gaps, complete the heat transfer between heating and cooling parts, but also played insulation, damping, sealing and so on, to meet the equipment miniaturization and ultra-thin design Requirements, which is a highly technology and use, and the thickness of the wide range of applications, is also an excellent thermal conductivity filler material.
Features > Good thermal conductive: 5.0 W/mK >Thickness:4.0mmT >hardness:20 shore00 >Colour: Gray >Outstanding thermal performance >High tack surface reduces contact resistance >RoHS compliant
Applications >Automotive electronics >Set top boxes >Audio and video components >IT infrastructure >GPS navigation and other portable devices >CD-Rom, DVD-Rom cooling
Company Profile
With professional R&D capabilities and over 13 year experiences in thermal interface material industry, Ziitek company own many unique formulations which are our core technologies and advantages. Our goal is to provide quality & competitive products to our customers worldwide aiming for long-term business cooperation.
Standard Thicknesses:
0.020" (0.51mm) 0.030" (0.76mm) 0.040" (1.02mm) 0.050" (1.27mm) 0.060" (1.52mm) 0.070" (1.78mm) 0.080" (2.03mm) 0.090" (2.29mm) 0.100" (2.54mm) 0.110" (2.79mm) 0.120" (3.05mm) 0.130" (3.30mm) 0.140" (3.56mm) 0.150" (3.81mm) 0.160" (4.06mm) 0.170" (4.32mm) 0.180" (4.57mm) 0.190" (4.83mm) 0.200" (5.08mm)
Consult the factory to alternate thickness.
FAQ: Q: What kind of packaging you offer? A: During the packaging process, preventive measures will be taken by us to assure that the goods are in a good condition during storage and delivery. |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Product Tags: 4.0mmt thermal gap pad smd led module thermal gap pad thermally conductive gap filler pads 5.0 w mk |
![]() |
Gray Thermal Conductive Material Thermal Gap Filler 45 Shore 00 TIF830HP 12.0 W/M-K |
![]() |
Sticky Soft Heatsink Cooling Gap Filler Thermal Conductive Silicone Pad |
![]() |
Thermal Conductivity 8.0W/m-K Heat Sink Thermal Pad for Electronic Devices CPU PC GPU |
![]() |
Cooling Thermal Conductive Silicone Gap Pad Filler For Laptop |
![]() |
2.5mmT Thickness 8W/mk Thermal Silicone Pad for AI Thermal Interface Material |
![]() |
Thermal Interface Material Pads Thermal Silicone Pad For New Energy Vehicle Batteries PCB |