Led Power Supply Gap Pad 5.0 W/M-K Gray Colour
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Broad range of hardnesses available thermal gap filler for Monitoring the Power Box
The TIF1140-50-11US use a special process, with silicone as the base material, adding thermal conductive powder and flame retardant together to make the mixture to become thermal interface material. This is effective in lower the thermal resistance between the heat source and the heat sink.
TIF100-50-11US-Datasheet-REV02.pdf
> Good thermal conductive: 5.0 W/mK >Thickness:3.5mmT >hardness:20 shore00 >Colour: Gray >Available in varies thicknesses >Broad range of hardnesses available >Moldability for complex parts
Applications >mainboard/mother board >notebook >power supply >Heat pipe thermal solutions >Memory Modules >Mass storage devices
Company Profile
Ziitek Electronic Material and Technology Ltd. is dedicated to developing composite thermal solution and manufacturing superior thermal interface materials for competitive market. Our vast experience allows us to assist our customers best in thermal engineering field. We serve customers with customized products, full product lines and flexible production, which makes us be the best and reliable partner of you. Let's make your design more perfect!
Certifications: ISO9001:2015 ISO14001: 2004 IATF16949:2016 IECQ QC 080000:2017 UL
FAQ: Q:How can we get detailed price list? A:Please offer us detailed information of the product such as Size(length,width,thickness),color,specific packaging requirements and purchasing quantity. |
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Product Tags: led power supply gap pad gap pad 5.0 w mk 5.0 w mk thermal gap filler |
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