2.8W / MK Conductivity Thermal Gap Filler Pad For PCB Board Applicated

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Dongguan Ziitek Electronic Materials & Technology Ltd.

City: dongguan

Province/State:guangdong

Country/Region:china

Tel:86--18153789196

Contact Person:
Ms.Dana Dai View Contact Details

2.8W / MK Conductivity Thermal Gap Filler Pad For PCB Board Applicated

Brand Name	ZIITEK
Model Number	TIF3160
Certification	UL and RoHs
Place of Origin	China
Minimum Order Quantity	1000pcs
Price	negotiation
Supply Ability	10000/day
Delivery Time	3-5work days
Packaging Details	1000pcs/bag
Application	PCB board
Heat Capacity	1 l /g-K
Color	gray
Thickness	4mmT
Hardness	35 Shore 00

Detailed Product Description

2.8W / MK Conductivity Thermal Gap Filler Pad For PCB Board Applicated

The TIF3160 thermal silicone pad is a product with both performance and economy. It is a unique thermal pad with low oil permeability, low thermal resistance, high softness and high compliance.It can work stably at -40℃~160℃ and meet the requirement of UL94V0.

Features:

> Perfect heat sinking
> Good thermal conductive: 2.8 W/mK

> Naturally tacky needing no further adhesive coating
> Soft and Compressible for low stress applications
> Thcikness: 3mmT

Applications:

> Automotive engine control units

> High speed mass storage drives
> Heat Sinking Housing at LED-lit BLU in LCD
> LED TV and LED-lit lamps

> Micro heat pipe thermal solutions

> Telecommunication hardware
> Handheld portable electronics
> Semiconductor automated test equipment

> RDRAM memory modules

> Cooling components to the chassis of frame

Typical Properties of TIF™3160
Color	gray	Visual	Composite Thickness	hermalImpedance @10psi (℃-in²/W)
Construction & Compostion	Ceramic filled silicone elastomer	***	10mils / 0.254 mm	0.21
			20mils / 0.508 mm	0.27
Specific Gravity	2.41 g /cc	ASTM D297	30mils / 0.762 mm	0.39
			40mils / 1.016 mm	0.43
Heat Capacity	1 l /g-K	ASTM C351	50mils / 1.270 mm	0.50
			60mils / 1.524 mm	0.58
Hardness	27 Shore 00	ASTM 2240	70mils / 1.778 mm	0.65
			80mils / 2.032 mm	0.76
Tensile Strength	40 psi	ASTM D412	90mils / 2.286 mm	0.85
			100mils / 2.540 mm	0.94
Continuos Use Temp	-40 to 160℃	***	110mils / 2.794 mm	1.00
			120mils / 3.048 mm	1.07
Dielectric Breakdown Voltage	>1500～>5500 VAC	ASTM D149	130mils / 3.302mm	1.16
			140mils / 3.556 mm	1.25
Dielectric Constant	5.5 MHz	ASTM D150	150mils / 3.810 mm	1.31
			160mils / 4.064 mm	1.38
Volume Resistivity	6.3X1012Ohm-meter	ASTM D257	170mils / 4.318 mm	1.43
			180mils / 4.572 mm	1.50
Fire rating	94 V-0	equivalent UL	190mils / 4.826 mm	1.60
			200mils / 5.080 mm	1.72
Thermal conductivity	2.8 W/m-K	ASTM D5470	Visua l/ ASTM D751	ASTM D5470

Certifications:

ISO9001:2015

ISO14001: 2004 IATF16949:2016

IECQ QC 080000:2017

Peressure Sensitive Adhesive:

Request adhesive on one side with "A1" suffix.
Request adhesive on double side with "A2" suffix.

Reinforcement:

TIF™ series sheets type can add with fiberglass reinforced.

Product Tags: thermally conductive filler thermal conductivity silicone 2.8W / MK Thermal Gap Filler

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2.8W / MK Conductivity Thermal Gap Filler Pad For PCB Board Applicated

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