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Dongguan Ziitek Electronic Materials & Technology Ltd.
Dongguan Ziitek Electronic Materials & Technology Ltd. Professional TIM Manufacturer
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Factory Thermal Conductive Gel For Electronic Components Cooling

Factory Thermal Conductive Gel For Electronic Components Cooling

Brand Name ZIITEK
Model Number TIF015-07
Certification UL and RoHs
Place of Origin China
Minimum Order Quantity 1000pcs
Price negotiation
Supply Ability 10000/day
Delivery Time 7-15work days
Packaging Details 1000tubes
Products Name Factory Thermal Conductive Gel For Electronic Components Cooling
Specific Gravity 2.5 g/cc
Good thermal conductive 1.5 W/mK
Color Green
Continuous Use Temperature -45~200℃
Flame Rating 94V0
Keywords Thermal Conductive Gel
Material Ceramic filled silicon material
Detailed Product Description

Factory Thermal Conductive Gel For Electronic Components Cooling

 

TIF015-07 is a soft silicone putty thermal gap filler,which blend with exclusive formula,that offer superior thermal performance, and compressibility. Due to TIF015-07 is made by high vicosity silicon oil ,that can prevent thermal formula seprate from it. Besides ,compared with traditionally thermal pad, it can control bonded shifiting issue much better.

 

TIF015-07 operation mold is simliar as grease ,such as silkprint and screen print or automatic injected facility. TIF015-07 can be applied on chip micro processor,PPGAs,Micro BGA package,BGA package,DSP chip,LED lighting and other high power electric component .

 

TIF015-07-Specification-sheet.-pdf.pdf

 

Application

 

> Heat-sink & frame

> LED backlight module,LED lighting

> Good thermal conductive
> Moldability for complex parts
> Soft and compressible for low stress applications

 

 

Feature

 

> Thermal conductivity: 1.5W/mK

> Soft, very low compression

> Audio and video components
> IT infrastructure
> GPS navigation and other portable devices
> CD-Rom, DVD-Rom cooling

 

 
TIFTM015-07 Property
PropertyValueTest method
ColorGreenVisual
Construction & CompositionCeramic filled silicon material*****
Viscosity4000 Pa.sGB/T 10247
Specific Gravity2.5g/cm³ASTM D297
Thermal conductivity1.5 W/mKISO 22007-2
Thermal diffusivity0.847 mm²/sISO 22007-2
Specific heat capacity2.2 MJ/m3KISO 22007-2
Continuous Use Temperature-45 ~200°C******
Flame Rating94V0UL E331100

 

Package :

 

30 cc/pc, 98 pc/box; 300 cc/pc 6 pc/box

We offer the custom packaged in syringes for automated despensing applications.

Please contact us for confirming.

 

 

Company Profile

 

With a wide range, good quality, reasonable prices and stylish designs, Ziitek thermal conductive interface materials are extensively used in Mainboards, VGA cards, Notebooks, DDR&DDR2 products, CD-ROM ,LCD TV, PDP products, Server Power products, Down lamps, Spotlights, Street lamps, Daylight lamps, LED Server Power products and others.

 

 

Ziitek Culture

 

Quality :

Do it right the first time, total quality control

Effectiveness:

Work precisely and thoroughly for effectiveness

Service:

Quick response, On time delivery and Excellent service

Team work:

Complete teamwork, including sales team, Marketing team, engineering team, R&D team, Manufacturing team, logistics team. All is for supporting and servicing a satisfy service for customers.

 
Product Tags: thermally conductive putty   electrically conductive putty  
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