Computer Serves Thermal Phase Changing Materials / Heat Sensitive Materials
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Computer Serves Thermal Phase Changing Materials / Heat Sensitive Materials
The TIC™808Y Series is low melting point thermal interface material. At 50℃, The TIC™800Y Series begins to soften and flow, filling the microscopic irregularities of both the thermal solution and the integrated circuit package surface, thereby reducing thermal resistance.The TIC™800Y Series is a flexible solid at room temperature and freestanding without reinforcing components that reduce thermal performance.
The TIC™808Y Series shows no thermal performance degradation after 1,000 hours@130℃,or after 500 cycles, from -25℃ to 125℃.The material softens and does
not fully change state resulting in minimal migration (pump out)at
operatin g temperatures.
Features
Applications
Standard Thicknesses: 0.003"(0.076mm) 0.005"(0.127mm) 0.008"(0.203mm) 0.010"(0.254mm) Consult the factory alternate thickness. Standard Sizes: 9" x 18"(228mm x 457mm) 9" x 400'(228mm x 121M) TIC™800 series are supplied with a white release paper and a bottom liner. TIC™800 series is available in kiss cut an extended pull tab liner or individual die cut shapes. Peressure Sensitive Adhesive: Peressure Sensitive Adhesive is not applicable for TIC™800 series products. Reinforcement: No reinforcement is necessary. Ziitek has independent R&D team. This team is experience, rigorous and pragmatic. They undertake the core research and development tasks of Ziitek thermal conductive materials. With well-equipped testing equipment, we Ziitek can also do some tests with customers' samples, so we can find a more suitable Ziitek materials for every customer.
Q: Do you offer free samples ? A: Yes, we are willing to offer free sample.
Q: What is your terms of payment ? A: Payment<=2000USD, T/T in advance. Paying in time and faithful for several months, we can apply other payment term for you, pay together in every month or 30 days. |
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