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1.2W/MK Thermal Conductive Silicone Adhesive Low Shrinkage Viscosity Room Temperature Cured

1.2W/MK Thermal Conductive Silicone Adhesive Low Shrinkage Viscosity Room Temperature Cured

Brand Name ziitek
Model Number TIS580-12
Certification RoHs
Place of Origin China
Minimum Order Quantity 25PC
Supply Ability 1000PC/Day
Delivery Time 2-3 work days
Packaging Details 300ml/1PC
Products name 1.2W/MK Thermal Conductive Silicone Adhesive Low Shrinkage Viscosity Room Temperature Cured
Appearance White paste
Density(g/cm3,25℃) 1.2
Operation temperature(℃) -60~250
Thermal Conductivity 1.2 W/(m·K)
Application highpower LED and internal storage module etc
Hardness 25 Shore 00
Detailed Product Description

1.2W/MK Thermal Conductive Silicone Adhesive Low Shrinkage Viscosity Room Temperature Cured

TIS™580-12 Series is dealcoholized, 1 component, room temperature cure thermally conductive silicone adhesive. It possesses good heat conduction and adhesion towards electronic components. It can be cured to a higher hardness elastomer, leads to firmly attached to substrates resulting lower down thermal impedance. Thus, heat transfer among heat source, heat-sink, motherboard, metal casing will become effective. TIS™580-12 Series possesses high thermal conductivity, excellent electrical insulation and is ready-to-use. TIS™580-12 Series has excellent adhesion to copper, aluminium, stainless-steel, etc. As this is a dealcoholized system, it will not corrode, especially, metal surfaces.

 

TIS580-12 Series Datasheet-(E)-REV01.pdf

 

Feature

 
Good thermal conductivity: 1.2W/mK
Good maneuverability and good adhesion
Low shrinkage
Low viscosity, leads to void-free surface
Good solvent resistance, water resistance
Longer working life
Excellent thermal shock resistance

 
Application
 
It mainly used in substituting thermally-conductive paste and pads, which currently finds in gap-filling adhesives or heat conduction between LED aluminium motherboard and heat sink, high power electrical module and heat sink. Traditional methods such as fins and screws fixing can be replaced by applying TIS580-13, resulting a more reliable gap-filling thermal conduction, simplified handling and more cost-effective.E.g. Massive application in integrated circuits in portable computer, microprocessor, high power LED, internal storage module, cache, integrated circuits, DC/AC translator, IGBT and other power modules, encapsulation of semi-conductors, relay switches, rectifiers and transfomers
 
 
Typical values of TISTM580-12
AppearanceWhite pasteTest Method
Density(g/cm3,25℃)1.3ASTM D297
Tack-free time(min,25℃)≤20*****
Cure type(1-component)Dealcoholized*****
Viscosity@25℃ Brookfield (Uncured)20K cpsASTM D1084
Total cure time(d, 25℃)3-7*****
Elongation(%)≥150ASTM D412
Hardness(Shore A)25ASTM D2240
Lap Shear Strength(MPa)≥2.0ASTM D1876
Peel Strength(N/mm)>3.5ASTM D1876
Operation temperature(℃)-60~250*****
Volume Resistivity(Ω·cm)2.0×1016ASTM D257
Dielectric Strength(KV/mm)21ASTM D149
Dielectric Constant (1.2MHz)2.9ASTM D150
Thermal Conductivity W/(m·K)1.2ASTM D5470
Flame RetardancyUL94 V-0

E331100

 
Company Profile

 

Ziitek company is a manufacturer of thermal conductive gap fillers, low melting point thermal interface materials, thermal conductive insulators, thermally conductive tapes, electrically & thermally conductive Interface pads and thermal grease,Thermal Conductive plastic,Silicone Rubber,Silicone Foams,Phase Changing Materials products, with well-equipped testing equipment and strong technical force.

 

Ziitek Culture

 

Quality :

Do it right the first time, total quality control

Effectiveness:

Work precisely and thoroughly for effectiveness

Service:

Quick response, On time delivery and Excellent service

Team work:

Complete teamwork, including sales team, Marketing team, engineering team, R&D team, Manufacturing team, logistics team. All is for supporting and servicing a satisfy service for customers.

 
Product Tags: thermally conductive adhesives   acrylic based adhesive  
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