LED Lamp Heat Resistant Adhesive Thermal Conductive With Ceramic Filled Silicone Elastomer
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Detailed Product Description
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LED Lamp Heat Resistant Adhesive Thermal Conductive with Ceramic Filled Silicone Elastomer
The TIA™810FG Series products are mostly used for bonding heat dissipation fins,
microprocessors and other power consumption semiconductors. This
type of adhesive tape possesses ultimate bonding strength with low
thermal impedance, with which in effect can be able to replace the
method of lubricating grease and mechanical fixing. Features > Thermal Conductivity: 1.2 W/mK > High bond strength to a variety of surfaces double sided pressure sensitive adhesive tape > High performance, thermally conductive acrylic adhesive Applications > Mount heat sink onto BGA graphic processor or drive processor > Mount heat spreader onto power converter PCB or onto motor control PCB > High performance, thermally conductive acrylic adhesive > Can be used instead of heat cure adhesive,screw mounting or clip mounting
Standard Thicknesses: 0.005"(0.127mm) 0.006"(0.152mm) 0.008"(0.203mm) 0.010"(0.254mm) 0.015"(0.381mm) 0.020"(0.508mm) Consult the factory alternate thickness. Standard Sizes: 10" x 18"(254mm x 457mm) 10" x 400'(254mm x 121.9M) Individual die cut shapes can be supplied. Reinforcement: TIA™800 Series sheets are fiberglass reinforced. |
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| Product Tags: adhesive foam tape thermally conductive adhesive tape Heat Resistant Adhesive Thermal Conductive | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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