2.54mm Thickness Ultrasoft Thermally Conductive Polymers Gap For CPU Heatsink Cooling
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2.54mm Thickness Ultrasoft Thermally Conductive Polymers Gap For CPU Heatsink Cooling
The TIF100-15-07E thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base. Their flexibility and elasticity make them suited to the coating of the very uneven surfaces. Heat can transmit to the metal housing or dissipation plate from the separate elements or even the entire PCB, which in effect enhances the efficiency and life-time of the heat-generating electronic components.
> Naturally tacky needing no further adhesive
coating
Standard Thicknesses: 0.010" (0.25mm) 0.020" (0.51mm) 0.030" (0.76mm) 0.040" (1.02mm) 0.050" (1.27mm) 0.060" (1.52mm) 0.070" (1.78mm) 0.080" (2.03mm) 0.090" (2.29mm) 0.100" (2.54mm) 0.110" (2.79mm) 0.120" (3.05mm) 0.130" (3.30mm) 0.140" (3.56mm) 0.150" (3.81mm) 0.160" (4.06mm) 0.170" (4.32mm) 0.180" (4.57mm) 0.190" (4.83mm) 0.200" (5.08mm) Consult the factory alternate thickness. Standard Sheets Sizes: 8" x 16"(203mm x 406mm) 16" x 18"(406mm x 457mm) TIF™ series Individual die cut shapes can be supplied. Peressure Sensitive Adhesive: Request adhesive on one side with "A1" suffix. Request adhesive on double side with "A2" suffix. Reinforcement: TIF™ series sheets type can add with fiberglass reinforced. Our services
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Product Tags: thermally conductive filler thermal conductivity silicone Thermally Conductive Polymers Gap |
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