2.5 W / mK Phase Changing Materials

2.5 W / mK Phase Changing Materials For IGBTs Cache Chips High Thermal Conductive

  The TIC™803A Series is low melting point thermal interface material. At 50℃, The TIC™800A Series begins to soften and flow, filling the microscopic irregularities of both the thermal solution and the integrated circuit package surface, thereby reducing thermal resistance.The TIC™800A Series is a flexible solid at room temperature and freestanding without reinforcing components that reduce thermal performance. 

      The TIC™803A Series shows no thermal performance degradation after 1,000 hours@130℃,or after 500 cycles, from -25℃ to 125℃.The material softens and does not fully change state resulting in minimal migration (pump out)at operating temperatures. 

Features:

> 0.018℃-in² /W thermal resistance
> Naturally tacky at room temperature, no adhesive required             
> No heat sink preheating required 

Applications:

> High Frequency Microprocessors

> Notebook and Desktop PCs
> Computer Serves
> Memory Modules
> Cache Chips
> IGBTs