Fiber Laser Cell Solar Silicon Wafers Scribing / Cutting / Dicing Easy Operation
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Fiber Laser Cell Solar Silicon Wafers Scribing / Cutting / Dicing Easy Operation
※Product Introduction
Solar technologies use the sun's energy to provide heat, light, hot water, electricity, and even cooling, for homes, businesses, and industry. Despite sunlight's significant potential for supplying energy, solar power provides less than 1% of U.S. energy needs. This percentage is expected to increase with the development of new and more efficient solar technologies. Perfect Laser produced a new generation of New laser scribing and spliting machine for solar cell/ solar panel /thin film mainly used for metal and silicon, germanium, gallium arsenide and other semiconductor material substrate scribing and cutting, machinable solar panels, silicon, ceramic , aluminum foil, etc., Artifacts refinement and blazonry, trimming smooth. Adopting Continuous pumping acousto-optic adjustable Q’s Nd: YAG laser as work light source, The two-dimensional work table is controlled by computer,and could do kinds of movement according to what graphics be input in.High output power, high precision scribing, fast speed and could cut curve and straight line graph.
※Product Features
1. Fiber Laser and strong suitability for the environment 2. High efficiency electro-optical conversion. 3. High precision and Air cooling 4. Stable and continuous processing but lower operation cost 5. Easy&convenient operation 6. Maintenance-free for 50000hours(no damageable parts&consumable parts be replaced) 7. Better quality beam(Base mode TEM00) & thinner cutting gap and smoother edge 8. Software updated to 5.0 9. Touch screen control,servo motor for option 10. Automatic absoption and without foot pedal 11. Imported Core parts
※The system composition
The equipment (PE-20W/50W laser scribing and spliting machine for solar cell/ solar panel /thin film) system mainly includes: automatic feeding system, automatic scribing system, automatic spliting system, automatic feeding and out-feeding system, negative pressure and dust removal system, control system, safety protection system.
※Product Advantage
1. The core parts adopt imported brand; 2. Fiber Laser has stronger adaptability to the environment; 3. Better beam quality(basic modeTEM000),thinner kerf width, more smooth edges; 4. Higher conversion efficiency, lower running cost, smaller equipment volume (air cooling); 5. The laser pulse width are more narrow, higher peak power, faster scribing speed; 6.[ Battery Cell automatic adsorption ,don’t need pedal;] 7. For a long time continuous operation without maintenance, no consumable parts replacement; 8. Software upgrade to version 5.0,parameters of concentrated control, software configurations save; 9. Touch screen operation, serve motor driving(optional).
※Technical Parameter
※Samples
★Packaging & Delivery
1. Prompt deliver at the very day. 2. Well-trained and disciplined packing team. 3. After-sale service:. Any questions or problems after receiving the product, please feel free to contact us. Problems would be solved for you immediately. 4. Sophisticated and professional logistic agent.
★Competitive Advantages
1. 100% custom pass guaranteed. 2. Our products have been exported to Germany, Norway, Poland, Finland, Spain, UK, France, Russia, USA, Brazil, Mexico, Australia, Japan, Korea, Thailand, Indonesia, Uruguay and many other countries. 3. Flexible and Untraceable payment terms. 4. Good after-sale service. 5. We offer high quality products at competitive price in quick delivery. |
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Product Tags: silicon wafer cutting machine laser scribe machine |
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