Precision Grinding And Polishing Machine HAP-100U

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HUATEC GROUP CORPORATION

City: beijing

Province/State:beijing

Country/Region:china

Tel:86-10-82921131

Contact Person:
Ms.Shifen Yuan View Contact Details

Precision Grinding And Polishing Machine HAP-100U

Brand Name	HUATEC
Model Number	HAP-100U
Certification	ISO，CE
Place of Origin	China
Minimum Order Quantity	1set
Payment Terms	L/C, T/T, Western Union
Supply Ability	100 sets per month
Delivery Time	7~15 days after payment
Packaging Details	in wooden box
Number of grinding and polishing heads	1
Polishing resolution	1 micron
Sample tilt angle	0-10 degrees adjustable
Sample swing speed	Adjustable

Detailed Product Description

Precision Grinding And Polishing Machine HAP-100U

I, Features

1. This product is used for precision grinding and polishing with high removal accuracy;

2. The sample is vacuum adsorbed, and the sample plate can be used for grinding and polishing 4-inch (HAP-200U: 6-inch) wafers;

3. The sample tilt angle can be adjusted;

4. The sample is gravity-pressurized, and the loading force is continuously adjustable;

5. The sample swings left and right to achieve semi-automatic grinding and polishing;

6. The swing speed of the swing arm is even and adjustable;

7. The swing range of the swing arm is adjustable from 0 to 15 degrees;

8. Adopt independent 1KW high -power motor with large torque. No matter the speed is fast or slow, the torque is large and constant.

9. The grinding and polishing disc has a wide range of speeds, from 5 rpm to 100 rpm ;

10. Full touch screen interface, easy to set grinding and polishing parameters;

11. All grinding and polishing parameters such as rotation speed, grinding and polishing time, rotation direction, etc. are automatically saved and easily called up;

12. Connect and control the droppers of four stations with different abrasives;

II. Technical Parameters

namesay	regulation grid
model	HAP-100U	HAP-200U
Number of grinding and polishing heads	1	2
Sample diameter	3 (option: 4 inch), can be used for grinding and polishing 3 (option: 4 inch) wafers	5 (option: 6 inch), can be used for grinding and polishing 5 (option: 6 inch) wafers
Polishing resolution	1 micron
Sample tilt angle	0-10 degrees adjustable
Sample loading force	Continuously adjustable from 0-4 kg
Sample swing speed	Adjustable
Swing range of arm	0-15 degrees adjustable
Grinding and polishing disc diameter ( mm)	φ300	φ400
Grinding and polishing disc motor power	1Kw
Speed (r/min)	5 -1 00
Rotation direction	Counterclockwise/clockwise optional, automatic switching between forward and reverse
Four-speed manual (r/min)	V1=5, V2=15, V3=25, V4=50 (user-customizable speed)
Automatic grinding and polishing parameters	64 types ( parameters include: speed, time and grinding disc rotation direction )
Grinding and polishing parameters	Users can set and call
Number of dripper units	Unit 4
Dripping speed	1-100 ml/min
power supply	Voltage: AC220V, Frequency: 50HZ
Overall dimensions ( mm )	760 x 4 30 x 3 60 (lengthwidthheight)
weight	30 kg

Serial number	Part name	quantity	Part name	quantity
1	HAP- 100U Precision Grinding and Polishing Compound	1 unit	Vacuum Pump	1 unit
2	Precision grinding jig	1 set	Dropper (option)	1 unit
3	Gas washing bottle (including connecting pipe)	1 set	Adhesive flocked polishing cloth 300mm	10 pcs
4	Adhesive sandpaper 300mm 180#	10 pcs	Adhesive canvas polishing cloth 300mm	10 pcs
5	Adhesive sandpaper 300mm 320#	10 pcs	Diamond suspension polishing liquid 1, 3,6 micron, 200 ml	1 bottle each
6	Sandpaper with adhesive backing 300mm 600#	10 pcs	Anti-stick disc 300mm	1
7	Sandpaper with adhesive backing 300mm 1000#	10 pcs	Magnetic plate 300mm	1
8	Adhesive sandpaper 300mm 2000#	10 pcs
9	Anti-stick disc pry bar (used for placing and prying the anti-stick disc)	1
	Technical documents: 1 copy each of product instruction manual, product certificate and warranty card

Product Tags: Precision Polishing Machine Precision Grinding And Polishing Machine

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