PCB New UV Laser Depaneling System with Lower Stress On The Parts

New UV Laser Depaneling System with Lower Stress On The Parts

Advantages of Laser PCB depaneling/singulation

• No mechanical stress on substrates or circuits
• No tooling cost or consumables.
• Versatility – ability to change applications by simply changing settings
• Fiducial Recognition – more precise and clean cut
• Optical Recognition before PCB depaneling/singulation process begins.
• Ability to depanel virtually any substrate. (Rogers, FR4, ChemA, Teflon, ceramics, aluminum, brass, copper, etc)
• Extraordinary cut quality holding tolerances as small as < 50 microns.
• No design limitation – ability to cut virtually and size PCB board including complex contours and multidimensional boards

Specification