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High-Frequency Jet Impingement Liquid Cooling Plate Also Commonly Referred

High-Frequency Jet Impingement Liquid Cooling Plate Also Commonly Referred

Brand Name Uchi
Model Number Heat Sink
Certification SMC
Place of Origin Dongguan,Guangdong,China
Minimum Order Quantity 100pcs
Price 1300-1500 dollars
Payment Terms T/T,paypal, Western Union,MoneyGram
Supply Ability 50000000pcs per Month
Delivery Time not limited
Application Electronics cooling, industrial machinery, automotive
Size 280x220x20mm
Protection Class IP54
Extra Process CNC Machining
Heat Source Power 30kW
Power 400W
Product Dimension Can be customized
Alloy Or Not Is Alloy
Surface Roughness 1.2 um
Packing PE Bag Carton
Material Copper / Aluminum
Detailed Product Description

High-Frequency Jet Impingement Liquid Cooling Plate

 
High-Frequency Jet Impingement Liquid Cooling Plate (also commonly referred to as Jet Impingement Cold Plate) is a special liquid cooling solution for ultra-high heat flux and ultra-fast temperature uniformity. Its core mechanism is to achieve extreme heat dissipation by directly impinging the inner wall of the heating surface with high-frequency, high-speed, and high-pressure micro-jets.
 

I. Core Principle (Essential Difference from Traditional Flow Channels)

 
Traditional Liquid Cooling Plate:
 
Coolant flows in parallel within enclosed channels for heat exchange, featuring thick thermal boundary layer, high thermal resistance, and prone to hot spots at distant positions.
 
High-Frequency Jet Impingement Type:
 
  • Coolant passes through a dense array of micro-nozzles (diameter 0.1–1 mm)
  • Impinges vertically at high speed onto the inner wall of the cold plate (heating surface)
  • Instantly breaks the thermal boundary layer, increasing local heat transfer coefficient by 5–10 times
  • Fluid diffuses rapidly and drains laterally, achieving extremely uniform temperature across the whole area (temperature difference < ±1℃)
 

II. Typical Structure

 
  • Upper Chamber (Distribution Chamber): stabilizes pressure and distributes coolant evenly to nozzles
  • Nozzle Plate: core component with hundreds to thousands of precision micro-holes (high-frequency jet array)
  • Impingement Chamber (Heat Exchange Zone): jet impingement and intensive convective heat transfer
  • Liquid Collection Chamber / Drainage Channel: quickly discharges the heat-absorbed coolant
 

III. Key Technical Features

 
  • Extremely High Heat Dissipation Capacity
     
    Heat flux density: 200–1000 W/cm² (ordinary brazed plate approx. 50 W/cm²)
     
    Thermal resistance as low as 0.01–0.03 ℃/W
     
  • Excellent Temperature Uniformity
     
    Full-surface temperature difference: ±0.5–±1℃
     
    Completely eliminates local hotspots
     
  • Fast Response Speed
     
    Low thermal inertia, precise temperature control, suitable for transient high-power and pulse heating scenarios
     
  • Relatively High Pressure Drop
     
    Requires matching high-pressure pump / high-flow cooling system
     
  • High Manufacturing Precision Requirements
     
    Nozzle hole diameter, depth, and position tolerance: ±0.02–±0.05 mm
     
 

IV. Main Manufacturing Processes

 
  • Precision Drilling + Vacuum Brazing
     
    Suitable for circular hole arrays with stable mass production
     
    Common materials: aluminum alloy / copper alloy, brazed sealing
     
  • Photolithography / Etching + Diffusion Bonding
     
    Suitable for special-shaped nozzles and micro-scale slot jets
     
    Finer flow channels and lower thermal resistance (for AI/GPU/laser applications)
     
  • 3D Printing (SLM)
     
    Integrated forming with complex topological channels + nozzles
     
    Lightweight design, suitable for customized aerospace components
     
 

V. Application Scenarios (Extreme Thermal Management)

 
  • AI / Supercomputing Chips: H100/H200, GPU clusters, TPUs (>500W chips)
  • SiC / GaN Power Modules: 800V electric drives, ultra-fast charging stations
  • High-Power Lasers: fiber / semiconductor / UV lasers (heat flux > 300W/cm²)
  • Radar / Phased Array: military T/R components, 5G/6G base stations
  • Medical Imaging: MRI gradient amplifiers, CT detectors (temperature control accuracy ±0.5℃)
  • Aerospace: satellite payloads, missile guidance (vibration-resistant, lightweight, high heat flux)
 

VI. Comparison with Conventional Liquid Cooling Plates

PerformanceConventional Flow Channel Liquid Cooling PlateHigh-Frequency Jet Impingement Liquid Cooling Plate
Heat Flux Density< 50 W/cm²200–1000 W/cm²
Thermal Resistance0.1–0.5 ℃/W0.01–0.03 ℃/W
Temperature UniformityTemperature difference 3–10℃Temperature difference < ±1℃
Pressure DropLow (0.5–2 bar)High (2–8 bar)
Application ScenariosConventional power devicesUltra-high heat flux, hotspot-sensitive, high-precision temperature control
 

VII. Summary

 
High-Frequency Jet Impingement Liquid Cooling Plate represents the state-of-the-art liquid cooling technology in modern industry, designed specifically for extreme heat flux, ultimate temperature uniformity, and high-precision temperature control.
Product Tags: high-frequency jet impingement liquid cooling plate   liquid cooling plate with jet impingement   high-performance liquid cooling plate  
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